Kaip turėtume mes renkamės tarp an ir a neoptinis BGA perdarymas stotis?
To figure this out, you first have to understand the differences between these two devices. From the production and application of BGA rework station, we can understand from the efficiency, the degree of use, operational difficulty, safety and success rate of these aspects.
1. Efektyvumas
Optinis BGA perdarymas stotis eliminuoja the manual focusing process. In the operation of the workers optical BGA rework station as long as the parameters are adjusted, you can automatically disassemble the BGA chip. The traditional non-optical BGA rework station in the use of the process is continuly required to rework staff to pay attention to the PCB board screen printing line and point alignment to achieve rework. Optinis BGA perdirbinys stotis nuo the efficiency is much higher than the traditional BGA rework station.
2. Laipsnis naudojimas
Su the use of BGA more and more widely, the complexity of BGA, rework equipment requirements are also higher and higher. So the future BGA rework station has to be nuolat updated to meet market demand.
3. Operacija sunkumas
Optinis BGA rework station is easy to operate, the wholere automated operation, beveik no technical requirements for rework personnel, with automatic welding, disassembly, mounting, feeding one-button operation, easy to use, easy to operate; configure the laser red dot positioning for different rework products, to achieve rapid conversion, without the need to set up cumbersome parameters. The traditional non-optical BGA rework station, the operator's requirements are very high, for the larger BGA chip rework even skilled maintenance personnel sometimes rework is very laborious, so you can see the difference between the two in the operation of the differentiation.
4. Nuo the safety and success rate
Pilnai automatinis optinis BGA perdarymas stotis dėl to the optical module per the split prism imaging, so there is no need for manual alignment at this time also eliminates the opportunity of damage to the BGA chip of the traditional manual alignment improper operation. For different sizes of BGA originalas visual alignment, suvirinimas, išardymas of the intelligent operation of the equipment, efficient improve the rework rate of produktyvumas, labai mažinimas kaštai. In santrauka, the optical alignment BGA rework station is much better than the traditional non-optical BGA rework station.

Savybės NeoDen ND722R BGA perdirbimas stotis
Power: 5.65KW (Max), Top heater (1.45KW), Bottom heater (1.2KW), IR Preheater (2.7KW), Other (0.3KW)
Veikimas Metodas: 7" HD lietimas ekranas
Valdymas Sistema : Autonominis šildymas valdymas sistema V2 (programinė įranga autorių teisės)
Ekranas Sistema : 15" SD pramoninis ekranas (720P priekinis ekranas)
Lygiavimas sistema : 2 milijonas pikselis skaitmeninis vaizdavimas sistema , automatinis optinis priartinimas lazeris % 3a raudonas taškas indikatorius
Temperatūra Kontrolė % 3a K tipas termoelementas uždaras ciklas valdymas su tikslumu iki % c2% b13 laipsnis
Maitinimas Įrenginys: Ne
Positioning: V-groove with universal fixture
